SOLDER focuses its efforts on designing and developing the proposed spectrum overlay technology for managing the efficient CA over HetNets and h-RATs. The Work Plan of SOLDER consists of the following Work Packages:
- WP1: Project Management
Lead by the Industrial Systems Institute of Athena Research Innovation Centre in Greece, this Work Package is responsible for the overall management of the project’s administrative and technical tasks, coordinating the deliverables provisioning.
- WP2: Carrier aggregation over HetNets and h-RATs: objectives, scenarios and requirements
Lead by the King’s College London, this Work Package will define the objectives, application scenarios and the overall functional requirements in terms of the system and user perspectives under which the CA algorithms will be developed.
- WP3: Aggregation of heterogeneous dispersed spectrum bands in HetNets and h-RATs
Lead by the Sequans Communications in France, this Work Package will investigate and specify the overall SOLDER system, which will consist in general of the CA over HetNets and h-RATs. RF-baseband co-design, PHY, MAC and RRM layers design and development will be provided.
- WP4: SOLDER system development and integration
Lead by the Eurecom in France, this Work Package will develop and finally integrate the SOLDER system as a whole in order to proof the concept of the aggregation of HetBands in next generation wireless communication systems.
- WP5: Dissemination and exploitation
Lead by the Thales Communications & Security SAS in France, this Work Package will provide the project visibility through dissemination actions like conference and forum participations, standardization initiatives etc. and will also provide all task related to the exploitation of the SOLDER technology.